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The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication.
February 20, 2019
By: Anthony Locicero
Copy editor, New York Post
American Semiconductor, Inc. launched the new AS_NRF51822 FleX-BLE IC. The Semiconductor-on-Polymer chip scale packaged system on chip supports Bluetooth Low Energy (BLE) communication. FleX-BLE is an ultra-thin and flexible SoP CSPversion of Nordic Semiconductor’s nRF51822 Multiprotocol Bluetooth Low Energy/2.4 GHz RF System on Chip. This feature-rich FleX-BLE product has an ARM CortexTM M0 processor, 256KB embedded Flash memory, 32KB RAM, encryption coprocessor, temperature sensor, ...
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